Home → Product Info→ AI2O3 part As a representative material of Fine Ceramics, it is widely used as an excellent material in terms of price and performance. SOLMICS has independently produced high purity alumina ceramic material and secured the technology to make any products by demonstrating the world's best products with 10 years of accumulated ceramic processing technology. SOLMICS Alumina ceramics produces more than 20,000 types from material to process and also produces, processes, and sells large products, and is even available for large size LCD products. As the No.1 domestic alumina ceramic sales manufacturer, SOLMICS supplies products to domestic and overseassemiconductor and LCD element companies and recorded a remarkable sales increase. Excellent performance compared to the price Good abrasion resistance due to the compact and stiff properties Excellent heat resistance and chemical resistance Insulation resistance at high temperatures and insulation strength against high pressure *Focus Ring performing plasma positioning and insulation and being used for semiconductor manufacturing facility requiring insulation rather than high purity *Edge Ring performing wafer positioning and plasma stability and normally being more used for semiconductor manufacturing facility requiring insulation performance *Ring Confiment Cap playing a role to control plasma pressure and being used to outer part at which Si electode is located on the upper part of the chamber *Other products Guide Ring, Rotation Ring Cover, Wafer Chuck, Wafer Clamp, Robot Arm, Robot Blade, Hot Arm, Cold Arm, Ceramic Pipe, Lift Pin, Ceramic Screw..etc. SOLMICS secures slip casting and CIP technology, which may advantageously produce a variety of products in terms of shapes and sizes such as plane, cube or tube with uniform density. As the slip casting and CIP technology affords mass production and customized production, meeting various customer requirements. Purity % 99.8 Bulk Density [g/cc] 3.9 more than Vickers Hardness [GPa] Load0.5Kg HVI-9.807N 17.2 ~ 17.5 Bending Strength [MPa] 345 ~ 370 Compressive Strength [Mpa] 2350 ~ 2400 Youngs Modulus [Gpa] 370 Poissons Ratio 0.23 Thermal Conductivity [W/mK] 30 Thermal Expansion [x10-6/°C] 7.8 Heat Shock Strength [△T°C] 350 Specific Heat [RT] (J/kg.K) 0.78 x 103 Max Useable Temperature [°C] 1400 ~1800 Volume Resistivity [Ω. ㎝] >1014 Dielectric Strength [V/m] 15 x 106 Dielectric Constant [25°C 1MHZ] 10