Home → Product Info→ Silicon part It is extracted from SiO2 (accounting for 60% of the lithosphere in forms of sand, rock, mineral, etc) , which is the second most plentiful mineral on the earth followed by oxygen. SOLMICS is the No.1 domestic manufacturer in business of semiconductor Si processed products since the processed products' price competitiveness and quality are already proven, as well as silicon ingots. Stably supplying materials owing to plentiful amount Less change of physical and mechanical properties according to temperature variation Easy high purity process Easy control of resistance rate by purification and impurities addition adjustment *Si Focus Ring functionally aligning plasma within a chamber after plasma is formed *Si Edge Ring aligning wafer accurately and supplementing Si Focus Ring, establishing plasma *Other products Si-Source Ring, Si Inner Ring, Si Slab, Si Heat Shield, etc Etching technology   : Silicon has a unique processing feature by which surface Impurities are diffused as much of the surface is processed while etching technology eliminates iron content layer, which is created by the heat generated due to friction between tool and silicon during surface process. Polishing technology : processing silicon surface with mirror plane. Purity % 99.99999999999 Non-dope Bulk Density [g/cc] 2.33 Vickers Hardness [GPa] Load0.5Kg HVI-9.807N 10.2 Bending Strength [MPa] ~300 Compressive Strength [Mpa] 481~549 Youngs Modulus [Gpa] 190 Poissons Ratio 0.27 Thermal Conductivity [W/mK] 157 Thermal Expansion [x10-6/°C] 3.9 Heat Shock Strength [△T°C]   Specific Heat [RT] (J/kg.K) 0.7 x 103 Max Useable Temperature [°C] 1300 Volume Resistivity [Ω. ㎝] 2.3 x 105 Dielectric Strength [V/m] 30x 106 Dielectric Constant [25°C 1MHZ]